| Modeling and analysis of crosstalk induced effects in multiwalled carbon nanotube bundle interconnects: An ABCD parameter-based approach M Sahoo, P Ghosal, H Rahaman IEEE Transactions on Nanotechnology 14 (2), 259-274, 2015 | 79 | 2015 |
| Modeling and analysis of crosstalk induced overshoot/undershoot effects in multilayer graphene nanoribbon interconnects and its impact on gate oxide reliability M Sahoo, H Rahaman Microelectronics Reliability 63, 231-238, 2016 | 23 | 2016 |
| Performance modeling and analysis of carbon nanotube bundles for future VLSI circuit applications M Sahoo, P Ghosal, H Rahaman Journal of Computational Electronics 13 (3), 673-688, 2014 | 19 | 2014 |
| Work function optimization for enhancement of sensitivity of dual-material (DM), double-gate (DG), junctionless MOSFET-based biosensor M Kumari, NK Singh, M Sahoo, H Rahaman Applied Physics A 127, 1-8, 2021 | 14 | 2021 |
| 2-D analytical modeling and simulation of dual material, double gate, gate stack engineered, junctionless MOSFET based biosensor with enhanced sensitivity M Kumari, NK Singh, M Sahoo, H Rahaman Silicon, 1-12, 2022 | 13 | 2022 |
| An ABCD parameter-based modeling and analysis of crosstalk induced effects in single-walled carbon nanotube bundle interconnects M Sahoo, P Ghosal, H Rahaman Fifth Asia Symposium on Quality Electronic Design (ASQED 2013), 264-273, 2013 | 13 | 2013 |
| An ABCD parameter based modeling and analysis of crosstalk induced effects in multilayer graphene nano ribbon interconnects M Sahoo, H Rahaman 2014 IEEE International symposium on circuits and systems (ISCAS), 1138-1142, 2014 | 12 | 2014 |
| Modeling of crosstalk induced effects in copper-based nanointerconnects: An ABCD parameter matrix-based approach M Sahoo, H Rahaman Journal of Circuits, Systems and Computers 24 (02), 1540007, 2015 | 11 | 2015 |
| An ABCD parameter based modeling and analysis of crosstalk induced effects in multiwalled carbon nanotube bundle interconnects M Sahoo, P Ghosal, H Rahaman 2014 27th International Conference on VLSI Design and 2014 13th …, 2014 | 11 | 2014 |
| Performance analysis of multiwalled carbon nanotube bundles M Sahoo, H Rahaman 2013 IEEE XXXIII International Scientific Conference Electronics and …, 2013 | 11 | 2013 |
| Analysis of crosstalk-induced effects in multilayer graphene nanoribbon interconnects M Sahoo, H Rahaman Journal of Circuits, Systems and Computers 26 (06), 1750102, 2017 | 10 | 2017 |
| A detailed investigation of dielectric-modulated dual-gate TMD FET based label-free biosensor via analytical modelling M Kumari, NK Singh, M Sahoo Scientific Reports 12 (1), 21115, 2022 | 9 | 2022 |
| Investigation on the effect of gate dielectric and other device parameters on digital performance of silicene nanoribbon tunnel FET NK Singh, M Sahoo IEEE Transactions on Electron Devices 67 (7), 2966-2973, 2020 | 9 | 2020 |
| On the suitability of single-walled carbon nanotube bundle interconnects for high-speed and power-efficient applications M Sahoo, H Rahaman, BB Bhattacharya Journal of Low Power Electronics 10 (3), 479-494, 2014 | 9 | 2014 |
| Design, modeling and analysis of Cu-carbon hybrid interconnects B Kumari, R Kumar, R Sharma, M Sahoo IEEE Access 9, 113577-113584, 2021 | 8 | 2021 |
| A compact short-channel analytical drain current model of asymmetric dual-gate TMD FET in subthreshold region including fringing field effects NK Singh, M Kumari, M Sahoo IEEE Access 8, 207982-207990, 2020 | 8 | 2020 |
| Analytical modeling of short-channel TMD TFET considering effect of fringing field and 2-D junctions depletion regions NK Singh, M Sahoo IEEE Transactions on Electron Devices 69 (2), 843-850, 2021 | 6 | 2021 |
| Temperature and dielectric surface roughness dependent performance analysis of Cu-graphene hybrid interconnects R Kumar, B Kumari, S Kumar, M Sahoo, R Sharma 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 6 | 2020 |
| Electrical and thermal analysis of cu-CNT composite TSV and GNR interconnects K Sable, M Sahoo 2020 International Symposium on Devices, Circuits and Systems (ISDCS), 1-6, 2020 | 6 | 2020 |
| Performance and signal integrity analysis of intercalation‐doped MLVGNR interconnects B Kumari, M Sahoo IET Circuits, Devices & Systems 14 (2), 192-199, 2020 | 5 | 2020 |
Hafizur RahamanIndian Institute of Engineering Science and Technology, ShibpurVerified email at it.iiests.ac.in
