| Predicting energy requirement for cooling the building using artificial neural network R Kumar, RK Aggarwal, JD Sharma, S Pathania Journal of Technology Innovations in Renewable Energy 1 (2), 113, 2012 | 28 | 2012 |
| Thermal impact on high speed PCB interconnects S Pathania, M Vasa, B Mutnury, R Sharma 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 9 | 2019 |
| Analyzing crosstalk-induced effects in rough on-chip copper interconnects S Pathania, S Kumar, R Sharma IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 9 | 2019 |
| Role of grain size on the effective resistivity of cu-graphene hybrid interconnects R Kumar, S Pathania, S Guglani, A Kumar, S Kumar, S Roy, BK Kaushik, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1620-1625, 2020 | 8 | 2020 |
| Crosstalk analysis for rough copper interconnects considering ternary logic S Pathania, S Kumar, R Sharma 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2018 | 6 | 2018 |
| Image enhancement and iris recognition using SIFT feature extraction H Kaur, S Pathania Int. J. Adv. Res. Electron. Commun. Eng.(IJARECE) 5 (5), 1254-1256, 2016 | 4 | 2016 |
| Multiphysics approach using computational fluid dynamics for signal integrity analysis in high speed serial links S Pathania, M Vasa, A Shrivastava, S Kumar, V Kumar, S Muthusamy, ... 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2019 | 3 | 2019 |
| Speech Recognition using Hidden Markov Model and Viterbi Algorithm S Bhardwaj, S Pathania, R Akela International Journal of Advanced Research in Electronics and Communication …, 2015 | 3 | 2015 |
| An artificial neural network surrogate model for repeater optimization in the presence of parametric uncertainty for hybrid copper-graphene interconnect networks A Sharif, S Pathania, S Kushwaha, S Roy, R Sharma, BK Kaushik 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2022 | 2 | 2022 |
| Thermal sensitivity of dielectric materials in high-speed designs S Pathania, B Mutnury, M Vasa, V Kumar, S Muthusamy, PK Seema, ... 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 2 | 2020 |
| Investigating the role of sidewall surface roughness on the performance of through silicon vias S Kumar, S Pathania, R Sharma 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-4, 2017 | 2 | 2017 |
| Design, analysis and selection of electric and magnetic loading for different rating of squirrel cage induction motors by using matlab gui software D Sharma, RK Saini, S Pathania Int. J. Innovative Res. Elec. Electron. Instrum. Control Eng 3 (4), 20-22, 2015 | 2 | 2015 |
| Space Mapped Neuromodeling for Fast & Accurate Signal Integrity Analysis of Rough On-chip Copper Interconnects S Kushwaha, S Guglani, N Soleimani, S Pathania, S Kumar, R Trinchero, ... 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2023 | | 2023 |
| Integrated thermal-electrical co-simulation V Kumar, M Vasa, A Shrivastava, B Mutnury, PK Seema, S Muthusamy, ... US Patent App. 17/716,527, 2023 | | 2023 |
| An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects S Pathania, S Kushwaha, S Kumar, M Vasa, A Shrivastava, V Kumar, ... 2023 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2023 | | 2023 |
| Signal integrity analysis of high speed onchip and chip-to-chip copper interconnects S Pathania | | 2022 |
| Crosstalk analysis for rough copper interconnects considering ternary logic R Sharma, S Kumar, S Pathania | | 2020 |
| Analyzing crosstalk-induced effects in rough on-chip copper interconnects R Sharma, S Kumar, S Pathania | | 2019 |
| Investigating the role of sidewall surface roughness on the performance of through silicon vias R Sharma, S Kumar, S Pathania | | 2018 |
| TRAFFIC JAM AND ACCIDENT DETECTION TECHNIQUES R Shaili, S Pathania | | 2016 |
