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- Jingsheng Jason CongVolgenau Chair for Engineering Excellence, Computer Science and Electrical Engineering, UniversityVerified email at cs.ucla.edu
- Guangyu SunSchool of Integrated Circuits, Peking UniversityVerified email at pku.edu.cn
- Yunxin LiuInstitute for AI Industry Research (AIR), Tsinghua UniversityVerified email at air.tsinghua.edu.cn
- Peng LiPostDoc of Computer Science, UCLAVerified email at cs.ucla.edu
- Jingwen LengProfessor, Shanghai Jiao Tong UniversityVerified email at cs.sjtu.edu.cn
- Zhenman FangAssistant Professor, Simon Fraser UniversityVerified email at sfu.ca
- Peipei ZhouAssistant Professor, Brown UniversityVerified email at brown.edu
- Wencong XiaoAlibaba GroupVerified email at alibaba-inc.com
- Bingjun XiaoUCLAVerified email at cs.ucla.edu
- Shijie CaoMicrosoft Research AsiaVerified email at microsoft.com
- Yuhao ZhuUniversity of RochesterVerified email at rochester.edu
- Yuxin WangPhD student of Computer Science, Peking UniversityVerified email at pku.edu.cn
- Peng ZhangComputer Science, University of Califronia, Los AngelesVerified email at cs.ucla.edu
- Guojie LuoPeking UniversityVerified email at pku.edu.cn
- Song JiangUniversity of Texas, ArlingtonVerified email at uta.edu
- Di WuNVIDIAVerified email at nvidia.com