Fred Wafula
Fred Wafula
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All electrochemical fabrication of a platinized nanoporous Au thin-film catalyst
DA McCurry, M Kamundi, M Fayette, F Wafula, N Dimitrov
ACS applied materials & interfaces 3 (11), 4459-4468, 2011
712011
Toward a better understanding of the effect of Cu electroplating process parameters on Cu 3 Sn voiding
L Yin, F Wafula, N Dimitrov, P Borgesen
Journal of electronic materials 41 (2), 302-312, 2012
332012
Impact of key deposition parameters on the voiding sporadically occurring in solder joints with electroplated copper
F Wafula, Y Liu, L Yin, S Bliznakov, P Borgesen, EJ Cotts, N Dimitrov
Journal of The Electrochemical Society 157 (2), D111, 2009
292009
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell
F Wafula, Y Liu, L Yin, P Borgesen, EJ Cotts, N Dimitrov
Journal of Applied Electrochemistry 41 (4), 469-480, 2011
262011
Mechanism of cobalt bottom-up filling for advanced node interconnect metallization
J Wu, F Wafula, S Branagan, H Suzuki, J van Eisden
Journal of The Electrochemical Society 166 (1), D3136, 2018
172018
Influence of poly (ethylene glycol) degradation on voiding sporadically occurring in solder joints with electroplated Cu
F Wafula, L Yin, P Borgesen, D Andala, N Dimitrov
Journal of electronic materials 41 (7), 1898-1906, 2012
162012
Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn
L Yin, P Kondos, P Borgesen, Y Liu, S Bliznakov, F Wafula, N Dimitrov, ...
2009 59th Electronic Components and Technology Conference, 406-414, 2009
152009
Impact of Bath Stability on Electroplated Cu for Through-Silicon Vias in a Controlled Manufacturing Environment
A Nguyen, K Fealey, P Reilly, G Pattanaik, A Gracias, F Wafula, M Flynn, ...
Journal of Microelectronics and Electronic Packaging 12 (1), 43-49, 2015
42015
Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper
F Wafula, Y Liu, L Yin, S Bliznakov, P Borgesen, E Cotts, N Dimitrov
ECS Transactions 19 (24), 43, 2009
42009
Short Loop Electrical And Reliability Learning For Through Silicon Via (TSV) Mid-Wafer Front-Side Processes
V Vartanian, K Hummler, S Olson, T Barbera, KH Yu, S Hu, A Fujita, ...
International Symposium on Microelectronics 2014 (1), 000794-000803, 2014
22014
Direct Cu plating of high aspect ratio through silicon vias (TSVs) with Ru seed on 300 mm wafer
F Wafula, G Pattanaik, J Enloe, K Hummler, B Sapp
IEEE International Interconnect Technology Conference, 143-146, 2014
22014
Electrolytic Cobalt Fill of Sub-5 nm Node Interconnect Features
F Wafula, J Wu, S Branagan, H Suzuki, A Gracias, J van Eisden
2018 IEEE International Interconnect Technology Conference (IITC), 123-125, 2018
12018
Cobalt Bottom-up Filling for Advanced Node Interconnect Metallization
J Wu, F Wafula, S Branagan, H Suzuki, J van Eisden
ECS Meeting Abstracts, 1050, 2019
2019
AQUEOUS COMPOSITION FOR DEPOSITING A COBALT DEPOSIT AND METHOD FOR ELECTROLYTICALLY DEPOSITING SUCH A DEPOSIT
F WAFULA, J ADOLF, J WU, J GAIDA, D ROHDE, G VAZHENIN
WO Patent WO/2019/013,761, 2019
2019
Cost Analysis of TSV Process and Scaling Options
V Vartanian, L Smith, K Hummler, S Olson, B Sapp, T Barbera, S Golovato, ...
International Symposium on Microelectronics 2014 (1), 000001-000007, 2014
2014
Complete Electrochemical Fabrication of a Platinized Nanoporous Au Catalyst for Formic Acid Oxidation
N Dimitrov, D McCurry, M Kamundi, M Fayette, F Wafula
ECS Meeting Abstracts, 2280, 2011
2011
Electroanalytical Approaches to Understand and Control Voiding Sporadically Occurring in Solder Joints with Electroplated Copper
FW Wafula
State University of New York at Binghamton, Department of Chemistry, 2011
2011
Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper
N Dimitrov, Y Liu, F Wafula, S Bliznakov, E Cotts, L Yin, P Borgesen
ECS Meeting Abstracts, 975, 2009
2009
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