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Anh Nguyen
Anh Nguyen
Colleges of Nanoscale Science and Engineering, SUNY Polytechnic Institute
Email confirmado em sunycnse.com - Página inicial
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Family structure, experiences with end-of-life decision making, and who asked about advance directives impacts advance directive completion rates
LJ Van Scoy, J Howrylak, A Nguyen, M Chen, M Sherman
Journal of palliative medicine 17 (10), 1099-1106, 2014
452014
Ldl subclass lipidomics in atherogenic dyslipidemia: Effect of statin therapy on bioactive lipids and dense ldl [s]
MJ Chapman, A Orsoni, R Tan, NA Mellett, A Nguyen, P Robillard, P Giral, ...
Journal of lipid research 61 (6), 911-932, 2020
442020
Tamper evident holographic devices and methods of manufacture
M Palmasi, A Nguyen, K Lee, L O'boyle
US Patent 6,214,443, 2001
352001
Hepatic fatty acid composition differs between chronic hepatitis C patients with and without steatosis
BM Arendt, SS Mohammed, E Aghdassi, NR Prayitno, DWL Ma, A Nguyen, ...
The Journal of nutrition 139 (4), 691-695, 2009
322009
Method of manufacturing tamper evident holographic devices
M Palmasi, A Nguyen, K Lee, L O'boyle
US Patent 6,436,483, 2002
222002
Formation of a low ohmic contact nickel silicide layer on textured silicon wafers using electroless nickel plating
A Nguyen, M Rane-Fondacaro, H Efstathiadis, P Haldar, L Michaelson, ...
Proc. of the 25th EPVSEC, 2672-2675, 2010
192010
Medical devices having laser brazed joints
A Nguyen, S Robaina
US Patent App. 11/113,768, 2006
92006
Heterogeneous integration of a 300-mm silicon photonics-CMOS wafer stack by direct oxide bonding and via-last 3-D interconnection
C McDonough, D La Tulipe, D Pascual, P Tariello, J Mucci, M Smalley, ...
Journal of Microelectronics and Electronic Packaging 13 (2), 71-76, 2016
62016
Heterogeneous integration of a 300mm silicon photonics-CMOS wafer stack by direct oxide bonding and via-last 3D interconnection
C McDonough, D La Tulipe, D Pascual, P Tariello, J Mucci, M Smalley, ...
International Symposium on Microelectronics 2015 (1), 000621-000626, 2015
62015
Testing for unit roots on heterogeneous panels: A sequential approach
PY Henin, P Jolivaldt, A Nguyen
CEPREMAP, 2001
62001
Impact of Bath Stability on Electroplated Cu for TSVs in a Controlled Environment
A Nguyen, K Fealey, P Reilly, G Pattanaik, A Gracias, F Wafula, M Flynn, ...
Journal of Microelectronics and Electronic Packaging 12 (1), 43-49, 2015
52015
Compatibility of the alternative seed layer (ASL) process with mono-Si and poly-Si substrates patterned by laser or wet etching
L Michaelson, AV Nguyen, K Munoz, JC Wang, T Tyson, ...
2011 37th IEEE Photovoltaic Specialists Conference, 001108-001112, 2011
52011
Feasibility of improving front metallization lines for photovoltaic devices
A Nguyen, A Fioramonti, D Morrissey, H Efstathiadis, Z Zhouying, ...
2009 34th IEEE Photovoltaic Specialists Conference (PVSC), 000312-000315, 2009
42009
THIN DIE INTERCONNECT PROCESS FOR 3DIC UTILIZING MULTIPLE LAYERS OF 50 MICRON THICK DIE ON 300MM WAFERS WITH A TACK AND COLLECTIVE BONDING APPROACH FOR MANUFACTURABILITY
D Pascual, C McDonough, A Nguyen, M Rao, R Carroll, D Coolbaugh, ...
International Wafer-Level Packaging Conference 2013 Proceedings, 2013
32013
Heterogeneous Integration of III-V Lasers in a 300 mm CMOS Manufacturing Line
S Baranowski, A Nguyen, MJ Hossain, S Kruger, LG Carpenter, A Dikshit, ...
IMAPSource Proceedings 2022 (1), 000465-000469, 2023
22023
An Investigation on the Effect of Upstream Processes on the Quality of Cu-Cu Bonding Interconnect Under Controlled Manufacturing Environment
A Nguyen, D Pascual, E Malocsay, P Fealey, Kevin, Tariello, P Reilly
International Wafer-Level Packaging Conference 2013 Proceedings, 2013
22013
Religion and socio-economic factors contribute to the possession of advanced directives in patients in an acute urban hospital
A Nguyen, LJ Van Scoy, MS Sherman
C17. COMMUNICATION AND END-OF-LIFE, A4013-A4013, 2010
22010
Genome‐wide study of the human lipidome and links to Alzheimer’s disease risk: Genome‐metabolome‐phenome: Towards an integrated molecular atlas for Alzheimer's disease
PJ Meikle, C Giles, G Cadby, K Huynh, NA Mellett, G Olshansky, A Smith, ...
Alzheimer's & Dementia 16, e045600, 2020
12020
Development of an industrial fabrication process for next generation, thinner and larger crystalline silicon (c-Si) wafer-based solar cells
AV Nguyen
State University of New York at Albany, 2012
12012
Understanding That the H-Bonding Network Controls Se Oxoanion Adsorption on Metal Oxides for Drinking Water Remediation–a Density Functional Theory Study
S Gupta, A Nguyen, CL Muhich
2021 AIChE Annual Meeting, 2021
2021
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Artigos 1–20