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Co-authors
George Q. HuangThe University of Hong KongVerified email at hku.hk
Li ZhiGuangdong University of TechnologyVerified email at gdut.edu.cn
WM Wang 王慧明Guangdong University of Technology, Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Ali V BarenjiSchool of Industrial and Systems Engineering, Georgia Institute of Technology, AtlantaVerified email at gatech.edu
Ray ZhongAssistant Professor at Department of Industrial and Manufacturing Systems Engineering, HKUVerified email at hku.hk
Guo HanyangSchool of Software Engineering, Sun Yat-sen UniversityVerified email at mail2.sysu.edu.cn
Gangyan XuHong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Yishuo JiangThe University of Hong KongVerified email at hku.hk
Kai KANGThe University of Hong KongVerified email at hku.hk
Eric TsuiThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Tian ZongguiMacau University of Science and TechnologyVerified email at student.must.edu.mo
Arjun Rachana HarishStudent at the University of Hong KongVerified email at connect.hku.hk
Benoit MontreuilProfessor, School of Industrial and Systems Engineering, Georgia Institute of Technology, AtlantaVerified email at isye.gatech.edu
Yelin FuDepartment of Industrial & Manufacturing Systems Engineering, The University of Hong KongVerified email at hku.hk