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Yaohui Fan
Yaohui Fan
Purdue University
Email confirmado em purdue.edu
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Influence of pad surface finish on the microstructure evolution and intermetallic compound growth in homogeneous Sn-Bi and Sn-Bi-Ag solder interconnects
Y Fan, Y Wu, TF Dale, SAP Lakshminarayana, CV Greene, NU Badwe, ...
Journal of Electronic Materials 50, 6615-6628, 2021
112021
Tin-bismuth low temperature solder systems-development and fundamental understanding
Y Fan
Purdue University, 2021
12021
Intermetallic compound growth and gold embrittlement effect in tin-bismuth low temperature solders on electroless nickel immersion gold (ENIG) surface finish
CH Yaohui Fan, Yifan Wu, Travis Dale, Sukshitha Achar, Nilesh Badwe, Raiyo ...
SMTAI 2020 Proceedings, 392-400, 2020
2020
Thermodynamic and Kinetic Effects on Microstructure Evolution in Hybrid Low Temperature Solder/High-Sn Solder Joints
Y Fan, Y Wu, JE Blendell, N Badwe, CA Handwerker
2019 6th International Workshop on Low Temperature Bonding for 3D …, 2019
2019
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Artigos 1–4