Liang Yin
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Citado por
Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigue
L Yin, L Wentlent, L Yang, B Arfaei, A Oasaimeh, P Borgesen
Journal of Electronic Materials 41 (2), 241-252, 2012
On the root cause of Kirkendall voiding in Cu3Sn
L Yin, P Borgesen
Journal of Materials Research 26 (3), 455-466, 2011
Dissolutive wetting in the Bi–Sn system
L Yin, BT Murray, TJ Singler
Acta materialia 54 (13), 3561-3574, 2006
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface
Y Liu, J Wang, L Yin, P Kondos, C Parks, P Borgesen, DW Henderson, ...
Journal of applied electrochemistry 38 (12), 1695-1705, 2008
Wetting in the Au–Sn system
L Yin, SJ Meschter, TJ Singler
Acta Materialia 52 (10), 2873-2888, 2004
Reactive wetting in metal/metal systems: Dissolutive versus compound-forming systems
L Yin, A Chauhan, TJ Singler
Materials Science and Engineering: A 495 (1-2), 80-89, 2008
Reactive wetting in metal–metal systems
L Yin, BT Murray, S Su, Y Sun, Y Efraim, H Taitelbaum, TJ Singler
Journal of Physics: Condensed Matter 21 (46), 464130, 2009
Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion
V Venkatadri, L Yin, Y Xing, E Cotts, K Srihari, P Borgesen
2009 59th Electronic Components and Technology Conference, 398-405, 2009
Sporadic degradation in board level drop reliability-those aren't all kirkendall voids!
P Borgesen, L Yin, P Kondos, DW Henderson, G Servis, J Therriault, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 136-146, 2007
Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure
B Arfaei, L Wentlent, S Joshi, A Alazzam, T Tashtoush, M Halaweh, ...
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
A mechanistic thermal fatigue model for SnAgCu solder joints
P Borgesen, L Wentlent, S Hamasha, S Khasawneh, S Shirazi, D Schmitz, ...
Journal of Electronic Materials 47 (5), 2526-2544, 2018
Silicon carbide integrated circuits with stable operation over a wide temperature range
R Ghandi, CP Chen, L Yin, X Zhu, L Yu, S Arthur, F Ahmad, P Sandvik
IEEE Electron Device Letters 35 (12), 1206-1208, 2014
Silicon carbide integrated circuits for extreme environments
AS Kashyap, CP Chen, R Ghandi, A Patil, E Andarawis, L Yin, ...
The 1st IEEE workshop on wide bandgap power devices and applications, 60-63, 2013
Improving copper electrodeposition in the microelectronics industry
Y Liu, L Yin, S Bliznakov, P Kondos, P Borgesen, DW Henderson, C Parks, ...
IEEE Transactions on Components and Packaging Technologies 33 (1), 127-137, 2009
Toward a better understanding of the effect of Cu electroplating process parameters on Cu3Sn voiding
L Yin, F Wafula, N Dimitrov, P Borgesen
Journal of electronic materials 41 (2), 302-312, 2012
Assessing the risk of “Kirkendall voiding” in Cu3Sn
P Borgesen, L Yin, P Kondos
Microelectronics Reliability 51 (4), 837-846, 2011
Modeling and experiments in dissolutive wetting: a review
TJ Singler, S Su, L Yin, BT Murray
Journal of Materials Science 47 (24), 8261-8274, 2012
Impact of key deposition parameters on the voiding sporadically occurring in solder joints with electroplated copper
F Wafula, Y Liu, L Yin, S Bliznakov, P Borgesen, EJ Cotts, N Dimitrov
Journal of The Electrochemical Society 157 (2), D111, 2009
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell
F Wafula, Y Liu, L Yin, P Borgesen, EJ Cotts, N Dimitrov
Journal of Applied Electrochemistry 41 (4), 469-480, 2011
Acceleration of the growth of Cu3Sn voids in solder joints
P Borgesen, L Yin, P Kondos
Microelectronics Reliability 52 (6), 1121-1127, 2012
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