Thermal stress induced delamination of through silicon vias in 3-D interconnects KH Lu, SK Ryu, Q Zhao, X Zhang, J Im, R Huang, PS Ho 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 149 | 2010 |
Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects SK Ryu, Q Zhao, M Hecker, HY Son, KY Byun, J Im, PS Ho, R Huang Journal of Applied Physics 111 (6), 2012 | 122 | 2012 |
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias T Jiang, SK Ryu, Q Zhao, J Im, R Huang, PS Ho Microelectronics Reliability 53 (1), 53-62, 2013 | 117 | 2013 |
Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis KH Lu, SK Ryu, Q Zhao, K Hummler, J Im, R Huang, PS Ho 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1475-1480, 2011 | 22 | 2011 |
Extension of micro-Raman spectroscopy for full-component stress characterization of TSV structures Q Zhao, J Im, R Huang, PS Ho 2013 IEEE 63rd Electronic Components and Technology Conference, 397-401, 2013 | 14 | 2013 |
Dielectric recoveries on O2 plasma damaged organosilicate low-k dielectrics HL Shi, JJ Bao, JJ Liu, H Huang, RS Smith, Q Zha, PS Ho, MD Goodner, ... Proceedings of the Advanced Metallization Conference 23, 447, 2007 | 6 | 2007 |
Thermomechanical characterization and modeling for TSV structures T Jiang, SK Ryu, Q Zhao, J Im, PS Ho, R Huang AIP Conference Proceedings 1601 (1), 148-157, 2014 | 4 | 2014 |
Thermal stress characteristics and reliability impact on 3-D ICs containing through-silicon-vias T Jiang, SK Ryu, Q Zhao, J Im, HY Son, KY Byun, R Huang, PS Ho 2012 IEEE 11th International Conference on Solid-State and Integrated …, 2012 | 4 | 2012 |
Thermal stress characteristics and impact on device keep-out zone for 3-D ICs containing through-silicon-vias T Jiang, SK Ryu, Q Zhao, J Im, HY Son, KY Byun, R Huang, PS Ho 2012 Symposium on VLSI Technology (VLSIT), 103-104, 2012 | 4 | 2012 |
Interfacial delamination between through silicon vias (TSVs) and silicon matrix KH Lu, SK Ryu, Q Zhao, R Huang, PS Ho ASME International Mechanical Engineering Congress and Exposition 44281, 105-112, 2010 | 4 | 2010 |
Indentation of single-crystal silicon nanolines: Buckling and contact friction at nanoscales B Li, Q Zhao, H Huang, Z Luo, MK Kang, JH Im, RA Allen, MW Cresswell, ... Journal of Applied Physics 105 (7), 2009 | 3 | 2009 |
Mechanical Characterization of High Aspect Ratio Silicon Nanolines H Huang, Q Zhao, Z Luo, JH Im, PS Ho, MK Kang, R Huang, ... MRS Online Proceedings Library (OPL) 1086, 1086-U05-07, 2008 | 2 | 2008 |
Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales H Huang, B Li, Q Zhao, Z Luo, J Im, MK Kang, RA Allen, MW Cresswell, ... AIP Conference Proceedings 1143 (1), 204-212, 2009 | 1 | 2009 |
Thermo-mechanical stress measurement and analysis in three dimensional interconnect structures Q Zhao | | 2014 |
Thermal-mechanical stress measurement and analysis in three dimensional interconnect structures with Raman spectroscopy Q Zhao | | 2013 |
Nanoindentation of Si Nanostructures: Buckling and H Huang, B Li, Q Zhao, Z Luo, J Im, MK Kang, RA Allen, MW Cresswell, ... | | |