| Ultra-sensitive and resilient compliant strain gauges for soft machines OA Araromi, MA Graule, KL Dorsey, S Castellanos, JR Foster, WH Hsu, ... Nature 587 (7833), 219-224, 2020 | 307 | 2020 |
| Gas chemical sensitivity of a CMOS MEMS cantilever functionalized via evaporation driven assembly KL Dorsey, SS Bedair, GK Fedder Journal of Micromechanics and Microengineering 24 (7), 075001, 2014 | 16 | 2014 |
| Dielectric charging effects in electrostatically actuated CMOS MEMS resonators KL Dorsey, GK Fedder SENSORS, 2010 IEEE, 197-200, 2010 | 14 | 2010 |
| Design considerations for photovoltaic energy harvesting in wearable devices KA Kim, FS Bagci, KL Dorsey Scientific Reports 12 (1), 18143, 2022 | 13 | 2022 |
| MEMS devices utilizing a thick metal layer of an interconnect metal film stack R Mahameed, KL Dorsey, MO Abdelmejeed, MA Abdelmoneum US Patent 9,493,340, 2016 | 10 | 2016 |
| Lifetime of liquid metal wires for stretchable devices KL Dorsey, N Lazarus Advanced Materials Technologies 6 (4), 2001100, 2021 | 9 | 2021 |
| In-hand object recognition with innervated fiber optic spectroscopy for soft grippers N Hanson, H Hochsztein, A Vaidya, J Willick, K Dorsey, T Padir 2022 IEEE 5th International Conference on Soft Robotics (RoboSoft), 852-858, 2022 | 8 | 2022 |
| 4H-silicon carbide pn diode for high temperature (600° C) environment applications SQ Shao, WC Lien, A Maralani, JC Cheng, KL Dorsey, AP Pisano Materials Science Forum 821, 636-639, 2015 | 7 | 2015 |
| Stability and control of a metal oxide gas sensor in simulated wind KL Dorsey, AP Pisano IEEE Sensors Journal 16 (3), 699-705, 2015 | 6 | 2015 |
| Analysis of DefeXtiles: a 3D printed textile towards garments and accessories KL Dorsey, SF Roberts, J Forman, H Ishii Journal of Micromechanics and Microengineering 32 (3), 034005, 2022 | 5 | 2022 |
| A Frenkel-Poole model of dielectric charging in CMOS MEMS KL Dorsey, GK Fedder 2011 16th International Solid-State Sensors, Actuators and Microsystems …, 2011 | 5 | 2011 |
| Mechanical isolation and temperature compensation in soft elastomer components KL Dorsey, M Cao, GA Slipher, N Lazarus IEEE Sensors Journal 18 (18), 7505-7512, 2018 | 4 | 2018 |
| Reconfigurable soft capacitive sensor with variable stiffness ring KL Dorsey 2019 2nd IEEE International Conference on Soft Robotics (RoboSoft), 378-383, 2019 | 3 | 2019 |
| Micro printing using microfluidics for printed biodegradable devices in trillion sensing N Terasaki, K Dorsey, M Makihata, AP Pisano ECS Transactions 75 (41), 13, 2017 | 3 | 2017 |
| MEMS devices utilizing a thick metal layer of an interconnect metal film stack R Mahameed, KL Dorsey, MOMM Abdelmejeed, MA Abdelmoneum US Patent 9,150,402, 2015 | 3 | 2015 |
| Functionalized micromolded nanoparticles towards gas sensor arrays KL Dorsey, DA Rolfe, GD Hoople, AP Pisano SENSORS, 2014 IEEE, 1344-1347, 2014 | 3 | 2014 |
| Origami-patterned capacitor with programmed strain sensitivity KL Dorsey, HY Huang, Y Wen Multifunctional Materials 5 (2), 025001, 2022 | 2 | 2022 |
| Sensor selection for outdoor air quality monitoring KL Dorsey, JR Herr, AP Pisano Next-Generation Robots and Systems 9116, 95-105, 2014 | 2 | 2014 |
| Work in progress-a provisional competency assessment system M Somerville, D Chachra, J Chambers, E Cooney, K Dorsey, JB Geddes, ... Proceedings Frontiers in Education 35th Annual Conference, S1C-1, 2005 | 2 | 2005 |
| Systems and Methods for Robotic Grippers With Fiber Optic Spectroscopy T Padir, A Vaidya, H Hochsztein, N Hanson, K Dorsey, JB Willick, ... US Patent App. 18/165,707, 2023 | 1 | 2023 |
Conor WalshAssociate Professor of Mechanical and Biomedical EngineeringEmail confirmado em seas.harvard.edu
