Safdar Malik
TítuloCitado porAno
Tuning the thermoelectric properties by manipulating copper in Cu2SnSe3 system
S Prasad, A Rao, B Christopher, R Bhardwaj, NS Chauhan, SA Malik, ...
Journal of Alloys and Compounds 748, 273-280, 2018
Solder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodes
SA Malik, LT Hung, N Van Nong
Materials Today Energy 5, 305-311, 2017
Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatment
SA Malik, TH Le, N Van Nong
Data in brief 15, 97-101, 2017
Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy
SA Malik, LT Hung, N Van Nong
Materials Today: Proceedings 8, 625-631, 2019
Contacts and Interface Evolution in Thermoelectric Modules
SA Malik, N Van Nong, E Stamate
Technical University of Denmark (DTU), 2018
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