Jeff Punch
Jeff Punch
Stokes Labs, Bernal Institute, University of Limerick
Verified email at ul.ie - Homepage
Title
Cited by
Cited by
Year
From chip to cooling tower data center modeling: Part I influence of server inlet temperature and temperature rise across cabinet
TJ Breen, EJ Walsh, J Punch, AJ Shah, CE Bash
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010
1162010
Friction factor and heat transfer in multiple microchannels with uniform flow distribution
HS Park, J Punch
International Journal of Heat and Mass Transfer 51 (17-18), 4535-4543, 2008
1122008
Design and fabrication of a hybrid superhydrophobic–hydrophilic surface that exhibits stable dropwise condensation
B Mondal, M Mac Giolla Eain, QF Xu, VM Egan, J Punch, AM Lyons
ACS applied materials & interfaces 7 (42), 23575-23588, 2015
992015
Pressure drop in two phase slug/bubble flows in mini scale capillaries
E Walsh, Y Muzychka, P Walsh, V Egan, J Punch
International Journal of Multiphase Flow 35 (10), 879-884, 2009
902009
Film thickness measurements in liquid–liquid slug flow regimes
MMG Eain, V Egan, J Punch
International Journal of Heat and Fluid Flow 44, 515-523, 2013
792013
Energy scavenging for energy efficiency in networks and applications
K Joon Kim, F Cottone, S Goyal, J Punch
Bell Labs Technical Journal 15 (2), 7-29, 2010
752010
Modeling electronic cooling axial fan flows
R Grimes, M Davies, J Punch, T Dalton, R Cole
J. Electron. Packag. 123 (2), 112-119, 2001
752001
Effect of Ag content on the microstructure of Sn‐Ag‐Cu based solder alloys
M Reid, J Punch, M Collins, C Ryan
Soldering & Surface Mount Technology, 2008
682008
Energy harvester apparatus having improved efficiency
F Cottone, S Goyal, J Punch
US Patent 8,350,394, 2013
602013
A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions
D Herkommer, J Punch, M Reid
Microelectronics Reliability 50 (1), 116-126, 2010
582010
From chip to cooling tower data center modeling: Part II influence of chip temperature control philosophy
EJ Walsh, TJ Breen, J Punch, AJ Shah, CE Bash
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010
492010
The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor
R Coyle, M Reid, C Ryan, R Popowich, P Read, D Fleming, M Collins, ...
2009 59th Electronic Components and Technology Conference, 423-430, 2009
482009
Phenomenological study of the effect of microstructural evolution on the thermal fatigue resistance of Pb-free solder joints
R Coyle, J Osenbach, MN Collins, H McCormick, P Read, D Fleming, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
462011
Finite element modelling of a BGA package subjected to thermal and power cycling
B Rodgers, J Punch, J Jarvis
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002
462002
Enhanced vibrational energy harvester based on velocity amplification
F Cottone, R Frizzell, S Goyal, G Kelly, J Punch
Journal of Intelligent Material Systems and Structures 25 (4), 443-451, 2014
432014
Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys
MN Collins, E Dalton, J Punch
Journal of Alloys and Compounds 688, 164-170, 2016
372016
Thermal fatigue and failure analysis of SnAgCu solder alloys with minor Pb additions
MN Collins, J Punch, R Coyle, M Reid, R Popowich, P Read, D Fleming
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
372011
Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys
E Dalton, G Ren, J Punch, MN Collins
Materials & Design 154, 184-191, 2018
352018
Local Nusselt number enhancements in liquid–liquid Taylor flows
MMG Eain, V Egan, J Punch
International Journal of Heat and Mass Transfer 80, 85-97, 2015
352015
Surface finish effect on reliability of SAC 305 soldered chip resistors
MN Collins, J Punch, R Coyle
Soldering & Surface Mount Technology, 2012
342012
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