Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments J Hornberger, AB Lostetter, KJ Olejniczak, T McNutt, SM Lal, A Mantooth 2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No. 04TH8720) 4, 2538-2555, 2004 | 212 | 2004 |
Time-varying harmonics. I. Characterizing measured data Y Baghzouz, RF Burch, A Capasso, A Cavallini, AE Emanuel, M Halpin, ... IEEE Transactions on Power Delivery 13 (3), 938-944, 1998 | 143 | 1998 |
Elements of wavelets for engineers and scientists DF Mix, KJ Olejniczak John Wiley & Sons, 2003 | 134 | 2003 |
Time-varying harmonics. II. Harmonic summation and propagation Y Baghzouz, RF Burch, A Capasso, A Cavallini, AE Emanuel, M Halpin, ... IEEE Transactions on Power Delivery 17 (1), 279-285, 2002 | 129 | 2002 |
Conversion of electrical energy from one form to another, and its management through multichip module structures KJ Olejniczak, KC Burgers, SS Ang, EV Porter US Patent 6,462,976, 2002 | 105 | 2002 |
Bidirectional, SiC module-based solid-state circuit breakers for 270 Vdc MEA/AEA systems J Hayes, K George, P Killeen, B McPherson, KJ Olejniczak, TR McNutt 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2016 | 55 | 2016 |
SiC-MOSFET composite boost converter with 22 kW/L power density for electric vehicle application H Kim, H Chen, D Maksimović, R Erickson, Z Cole, B Passmore, ... 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 134-141, 2017 | 42 | 2017 |
Design of a 250 kW, 1200 V SiC MOSFET-based three-phase inverter by considering a subsystem level design optimization approach AH Wijenayake, KJ Olejniczak, D Simco, S Minden, M Feurtado, ... 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 939-946, 2017 | 41 | 2017 |
Dynamic characterization of next generation medium voltage (3.3 kV, 10 kV) silicon carbide power modules J Hayes, WA Curbow, B Sparkman, D Martin, K Olejniczak, A Wijenayake, ... PCIM Europe 2017; International Exhibition and Conference for Power …, 2017 | 38 | 2017 |
A 650 V/150 A enhancement mode GaN-based half-bridge power module for high frequency power conversion systems B Passmore, S Storkov, B McGee, J Stabach, G Falling, A Curbow, ... 2015 IEEE Energy Conversion Congress and Exposition (ECCE), 4520-4524, 2015 | 38 | 2015 |
A compact 110 kVA, 140 C ambient, 105 C liquid cooled, all-SiC inverter for electric vehicle traction drives K Olejniczak, T Flint, D Simco, S Storkov, B McGee, R Shaw, B Passmore, ... 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 735-742, 2017 | 37 | 2017 |
Terahertz imaging for nondestructive evaluation of packaged power electronic devices NM Burford, MO El-Shenawee, CB O’neal, KJ Olejniczak Int. J. Emerg. Technol. Adv. Eng 4 (1), 395-401, 2014 | 37 | 2014 |
Basic mechanisms of generation and flow of harmonic signals in balanced and unbalanced three-phase power systems K Olejniczak, GT Heydt IEEE Power Engineering Review 9 (10), 58-58, 1989 | 34 | 1989 |
Role of laboratory education in power engineering: Is the virtual laboratory feasible? I GG Karady, GT Heydt, KJ Olejniczak, HA Mantooth, S Iwamoto, ML Crow 2000 Power Engineering Society Summer Meeting (Cat. No. 00CH37134) 3, 1471-1477, 2000 | 32 | 2000 |
Scanning the special section on the Hartley transform KJ Olejniczak, GT Heydt Proceedings of the IEEE 82 (3), 371-380, 1994 | 30 | 1994 |
Application of the Hartley transform for the analysis of the propagation of nonsinusoidal waveforms in power systems GT Heydt, KJ Olejniczak, R Sparks, E Viscito IEEE transactions on power delivery 6 (4), 1862-1868, 1991 | 28 | 1991 |
Direct liquid cooling of high performance Silicon Carbide (SiC) power modules B McPherson, B McGee, D Simco, K Olejniczak, B Passmore 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 1-5, 2017 | 23 | 2017 |
First automotive reliability assessment and drive-train performance of large-area 900V, 10mOhm SiC MOSFETs JB Casady, B Hull, J Zhang, D Gajewski, GY Wang, S Allen, J Palmour, ... 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 2259-2262, 2017 | 20 | 2017 |
Polymer thick film (PTF) and flex technologies for low cost power electronics packaging AB Lostetter, F Barlow, A Elshabini, K Olejniczak, S Ang IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No …, 2000 | 20 | 2000 |
The hartley transform KJ Olejniczak The transforms and applications handbook 281, 2000 | 18 | 2000 |