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Ali JaveyProfessor of Electrical Engineering, UC BerkeleyVerified email at eecs.berkeley.edu
Kuniharu TakeiOsaka Metropolitan University, JAPANVerified email at omu.ac.jp
Rehan KapadiaAssistant Professor, University of Southern CaliforniaVerified email at usc.edu
Steven ChuangUC BerkeleyVerified email at cornell.edu
Yu-Lun ChuehNational Tsing Huniversity, Materials Science and EngineeringVerified email at mx.nthu.edu.tw
Sanjay KrishnaProfessor and George R Smith Chair of Engineering, ECE Department, Ohio State UniversityVerified email at osu.edu
John A. RogersSimpson/Querrey Professor, Northwestern UniversityVerified email at northwestern.edu
Elena PlisAssurance Technology CorporationVerified email at assurtech.com
Kyung Jin SeoDartmouth CollegeVerified email at dartmouth.edu
Jing GuoProfessor, University of FloridaVerified email at ufl.edu
ENMING SONGFudan UniversityVerified email at fudan.edu.cn
Yiding ZhongBoston UniversityVerified email at bu.edu
Mahmut TosunPhD Student, UC BerkeleyVerified email at berkeley.edu
Ki Jun YuAssociate Professor, School of Electrical and Electronic Engineering at Yonsei UniversityVerified email at yonsei.ac.kr
Yonggang HuangWalter P. Murphy Professor of M.E., C.E.E. and M.S.E., Northwestern UniversityVerified email at northwestern.edu
Ting Chia ChangStanford UniversityVerified email at stanford.edu
Ha Sul KimProfessor of Physics, Chonnam National University, South KoreaVerified email at jnu.ac.kr
Morten MadsenUniversity of Southern Denmark, Mads Clausen Institute, SDU NanoSYDVerified email at mci.sdu.dk
Yi QiangDartmouth CollegeVerified email at dartmouth.edu
Corsin BattagliaEmpa - Swiss Federal Laboratories for Materials Science and TechnologyVerified email at empa.ch