| CLEAR: Cross-layer exploration for architecting resilience: Combining hardware and software techniques to tolerate soft errors in processor cores E Cheng, S Mirkhani, LG Szafaryn, CY Cher, H Cho, K Skadron, MR Stan, ... Design Automation Conference (DAC), 2016 53nd ACM/EDAC/IEEE, 1-6, 2016 | 101 | 2016 |
| The resilience wall: Cross-layer solution strategies S Mitra, P Bose, E Cheng, CY Cher, H Cho, R Joshi, YM Kim, CR Lefurgy, ... Proceedings of Technical Program-2014 International Symposium on VLSI …, 2014 | 47 | 2014 |
| Self-repair of uncore components in robust system-on-chips: An opensparc t2 case study Y Li, E Cheng, S Makar, S Mitra 2013 IEEE International Test Conference (ITC), 1-10, 2013 | 30 | 2013 |
| Tolerating Soft Errors in Processor Cores Using CLEAR (Cross-Layer Exploration for Architecting Resilience) E Cheng, S Mirkhani, LG Szafaryn, CY Cher, H Cho, K Skadron, MR Stan, ... IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2017 | 26 | 2017 |
| System-level effects of soft errors in uncore components H Cho, E Cheng, T Shepherd, CY Cher, S Mitra IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2017 | 23 | 2017 |
| ETISS-ML: A multi-level instruction set simulator with RTL-level fault injection support for the evaluation of cross-layer resiliency techniques D Mueller-Gritschneder, M Dittrich, J Weinzierl, E Cheng, S Mitra, ... 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 609-612, 2018 | 11 | 2018 |
| Very Low Voltage (VLV) Design R Bertran, P Bose, D Brooks, J Burns, A Buyuktosunoglu, ... 2017 IEEE International Conference on Computer Design (ICCD), 601-604, 2017 | 11 | 2017 |
| Cross-layer resilience to tolerate hardware errors in digital systems E Cheng Stanford University, 2018 | 6 | 2018 |
| Cross-layer resilience in low-voltage digital systems: key insights E Cheng, J Abraham, P Bose, A Buyuktosunoglu, K Campbell, D Chen, ... 2017 IEEE International Conference on Computer Design (ICCD), 593-596, 2017 | 6 | 2017 |
| Self-repair of Uncore components in robust systems-on-chips Y Li, E Cheng, S Makar, S Mitra SELSE, 2013 | 3 | 2013 |
| Cross-Layer Resilience Against Soft Errors: Key Insights D Mueller-Gritschneder, E Cheng, U Sharif, V Kleeberger, P Bose, S Mitra, ... Dependable Embedded Systems, 249-275, 2021 | | 2021 |
| Cross-layer resilience E Cheng, S Mitra Cross-Layer Reliability of Computing Systems, 113, 2020 | | 2020 |
