| Bismuth-based transient liquid phase (TLP) bonding as high-temperature lead-free solder alternatives J Cho, R Sheikhi, S Mallampati, L Yin, D Shaddock 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1553-1559, 2017 | 15 | 2017 |
| Developments of Bi-Sb-Cu alloys as a high-temperature Pb-free solder J Cho, S Mallampati, H Schoeller, L Yin, D Shaddock 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1251-1256, 2015 | 11 | 2015 |
| The study of the polydispersivity effect on the thermal conductivity of particulate thermal interface materials by finite element method B Dan, BG Sammakia, G Subbarayan, S Kanuparthi, S Mallampati IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 11 | 2013 |
| Developments of high-Bi alloys as a high temperature Pb-free solder S Mallampati, H Schoeller, L Yin, D Shaddock, J Cho 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1328-1334, 2014 | 10 | 2014 |
| Exploring bismuth as a new Pb-free alternative for high temperature electronics J Cho, S Mallampati, R Tobias, H Schoeller, L Yin, D Shaddock 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 432-438, 2016 | 9 | 2016 |
| Lead-free alternatives for interconnects in high-temperature electronics S Mallampati, L Yin, D Shaddock, H Schoeller, J Cho Journal of Electronic Packaging 140 (1), 010906, 2018 | 8 | 2018 |
| A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package S Mallampati, Z Baig, S Pozder, EC Chua IRPS, 2019 | 4 | 2019 |
| The study of the polydispersivity effect on the thermal conductivity of particulate Thermal Interface Materials to refine the Random Network Model B Dan, BG Sammakia, S Kanuparthi, G Subbarayan, S Mallampati 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 2 | 2012 |
| Influence of second phase particles on thermal conductivity of bi alloys S Mallampati, H Schoeller, L Yin, D Shaddock, J Cho IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 1 | 2022 |
| High Bismuth Alloys as Lead-Free Alternatives for Interconnects in High-Temperature Electronics S Mallampati State University of New York at Binghamton, 2017 | 1 | 2017 |
| A representative finite element model for determining the effective thermal conductivity of particulate thermal interface materials S Mallampati State University of New York at Binghamton, 2011 | 1 | 2011 |
