| Development of a troponin I biosensor using a peptide obtained through phage display J Wu, DM Cropek, AC West, S Banta Analytical Chemistry 82 (19), 8235-8243, 2010 | 88 | 2010 |
| Rapid development of new protein biosensors utilizing peptides obtained via phage display J Wu, JP Park, K Dooley, DM Cropek, AC West, S Banta PLoS One 6 (10), e24948, 2011 | 68 | 2011 |
| Metal-ion adsorption on carboxyl-bearing self-assembled monolayers covalently bound to magnetic nanoparticles B Hai, J Wu, X Chen, JD Protasiewicz, DA Scherson Langmuir 21 (7), 3104-3105, 2005 | 53 | 2005 |
| Mechanism of cobalt bottom-up filling for advanced node interconnect metallization J Wu, F Wafula, S Branagan, H Suzuki, J van Eisden Journal of the Electrochemical Society 166 (1), D3136, 2018 | 36 | 2018 |
| Monitoring the conformational changes of an intrinsically disordered peptide using a quartz crystal microbalance O Shur, J Wu, DM Cropek, S Banta Protein Science 20 (5), 925-930, 2011 | 18 | 2011 |
| Binding of Cd2+ to Self-Assembled Bilayers Bearing Pyridine Terminal Groups: Attenuated Total Reflection Fourier Transform Infrared Spectroscopic Studies D Burshtain, J Wu, A Melman, D Mandler, DA Scherson Langmuir 20 (11), 4498-4502, 2004 | 12 | 2004 |
| Electrolytic cobalt fill of sub-5 nm node interconnect features F Wafula, J Wu, S Branagan, H Suzuki, A Gracias, J van Eisden 2018 IEEE International Interconnect Technology Conference (IITC), 123-125, 2018 | 7 | 2018 |
| Electrochemical Quartz Crystal Microbalance Studies of Gold Oxidation in Cyanide Baths Z Liu, J Wu, AC West Electrochemical and Solid-State Letters 14 (1), D1, 2010 | 4 | 2010 |
| Cadmium ion adsorption on carboxyl-terminated iron oxide beads J Wu, J Sun, IC Stefan, DA Scherson The Journal of Physical Chemistry B 108 (33), 12276-12279, 2004 | 3 | 2004 |
| The Impact of Electrolyte Acidity on Bottom-up Metallization of Copper Interconnects L Boehme, J Wu, X Kang, R Preisser, U Landau ECS Meeting Abstracts, 2734, 2012 | 2 | 2012 |
| In situ solution-phase Raman spectroscopy under forced convection H Zhu, J Wu, Q Shi, Z Wang, DA Scherson Analytical chemistry 79 (21), 8004-8009, 2007 | 2 | 2007 |
| High Density Copper Nucleation on Ruthenium and Its Application to Direct Plating of Advanced Interconnects P Shi, J Wu ECS Transactions 52 (1), 437, 2013 | 1 | 2013 |
| (Invited) Cobalt Bottom-up Filling for Advanced Node Interconnect Metallization J Wu, F Wafula, S Branagan, H Suzuki, J van Eisden Electrochemical Society Meeting Abstracts 235, 1050-1050, 2019 | | 2019 |
| Jumctions of Tetrahedral Amorphous Carbon Containing Nitrogen (taC: N) on Semiconductors for Photoelectrochemical Solar Cells D Scherson, J Wu, B Miller ECS Meeting Abstracts, 1299, 2006 | | 2006 |
| Surface Modified Electrodes and Their Reactivity J Wu Case Western Reserve University, 2006 | | 2006 |
| METAL-ION ADSORPTION ON SURFACE MODIFIED MAGNETIC BEADS J Wu, IC Stefan, DA Scherson | | |
