| Micro-fabrication of polymeric devices using hot roller embossing LP Yeo, SH Ng, Z Wang, Z Wang, NF de Rooij Microelectronic engineering 86 (4-6), 933-936, 2009 | 97 | 2009 |
| Thermally activated solvent bonding of polymers SH Ng, RT Tjeung, ZF Wang, ACW Lu, I Rodriguez, NF de Rooij Microsystem Technologies 14, 753-759, 2008 | 83 | 2008 |
| Investigation of hot roller embossing for microfluidic devices LP Yeo, SH Ng, ZF Wang, HM Xia, ZP Wang, VS Thang, ZW Zhong, ... Journal of Micromechanics and Microengineering 20 (1), 015017, 2009 | 80 | 2009 |
| Hot roller embossing for microfluidics: process and challenges SH Ng, ZF Wang Microsystem technologies 15, 1149-1156, 2009 | 67 | 2009 |
| Simulation of droplet formation and coalescence using lattice Boltzmann-based single-phase model XQ Xing, DL Butler, SH Ng, Z Wang, S Danyluk, C Yang Journal of Colloid and Interface Science 311 (2), 609-618, 2007 | 65 | 2007 |
| Studies on a micro combustor for gas turbine engines XC Shan, ZF Wang, YF Jin, M Wu, J Hua, CK Wong, R Maeda Journal of Micromechanics and Microengineering 15 (9), S215, 2005 | 59 | 2005 |
| Plug-and-play microvalve and micropump for rapid integration with microfluidic chips SAM Shaegh, Z Wang, SH Ng, R Wu, HT Nguyen, LCZ Chan, AGG Toh, ... Microfluidics and Nanofluidics 19, 557-564, 2015 | 57 | 2015 |
| Improving surface smoothness of laser-fabricated microchannels for microfluidic application ZK Wang, HY Zheng, RYH Lim, ZF Wang, YC Lam Journal of Micromechanics and Microengineering 21 (9), 095008, 2011 | 55 | 2011 |
| Detachable acoustophoretic system for fluorescence-activated sorting at the single-droplet level P Li, Z Ma, Y Zhou, DJ Collins, Z Wang, Y Ai Analytical chemistry 91 (15), 9970-9977, 2019 | 54 | 2019 |
| Magnetic field-assisted finishing of a mold insert with curved microstructures for injection molding of microfluidic chips J Guo, K Liu, Z Wang, GL Tnay Tribology International 114, 306-314, 2017 | 53 | 2017 |
| Microfluidic connectors by ultrasonic welding SH Ng, ZF Wang, NF De Rooij Microelectronic Engineering 86 (4-6), 1354-1357, 2009 | 46 | 2009 |
| MEMS vacuum packaging technology and applications Y Jin, ZF Wang, PC Lim, DY Pan, J Wei, CK Wong Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003 | 46 | 2003 |
| Converting steady laminar flow to oscillatory flow through a hydroelasticity approach at microscales HM Xia, ZP Wang, W Fan, A Wijaya, W Wang, ZF Wang Lab on a Chip 12 (1), 60-64, 2012 | 44 | 2012 |
| Development of 1× 4 MEMS-based optical switch ZF Wang, W Cao, XC Shan, JF Xu, SP Lim, W Noell, NF De Rooij Sensors and Actuators A: Physical 114 (1), 80-87, 2004 | 39 | 2004 |
| Microstructure of eutectic 80Au/20Sn solder joint in laser diode package JWR Teo, FL Ng, LSK Goi, YF Sun, ZF Wang, XQ Shi, J Wei, GY Li Microelectronic Engineering 85 (3), 512-517, 2008 | 35 | 2008 |
| A novel integrated silicon capacitive microphone-floating electrode" electret" microphone (FEEM) Q Zou, Z Tan, Z Wang, J Pang, X Qian, Q Zhang, R Lin, S Yi, H Gong, ... Journal of microelectromechanical systems 7 (2), 224-234, 1998 | 35 | 1998 |
| Chemical mechanical polishing of polymeric materials for MEMS applications ZW Zhong, ZF Wang, YH Tan Microelectronics Journal 37 (4), 295-301, 2006 | 31 | 2006 |
| A study on corrugated diaphragms for high-sensitivity structures Q Zou, Z Wang, R Lin, S Yi, H Gong, M Lim, Z Li, L Liu Journal of Micromechanics and Microengineering 7 (4), 310, 1997 | 29 | 1997 |
| Zr/V/Fe thick film for vacuum packaging of MEMS Y Jin, Z Wang, L Zhao, PC Lim, J Wei, CK Wong Journal of Micromechanics and Microengineering 14 (5), 687, 2004 | 28 | 2004 |
| Thermal bonding of thermoplastic elastomer film to PMMA for microfluidic applications S Yu, SP Ng, Z Wang, CL Tham, YC Soh Surface and Coatings Technology 320, 437-440, 2017 | 27 | 2017 |
Z.W. ZhongNTUVerified email at ntu.edu.sg
