| Microstructure, mechanical properties, and deformation behavior of Sn–1.0 Ag–0.5 Cu solder after Ni and Sb additions AA El-Daly, AE Hammad, A Fawzy, DA Nasrallh Materials & design 43, 40-49, 2013 | 161 | 2013 |
| Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys AA El-Daly, Y Swilem, MH Makled, MG El-Shaarawy, AM Abdraboh Journal of Alloys and Compounds 484 (1-2), 134-142, 2009 | 132 | 2009 |
| Creep properties of Sn–Sb based lead-free solder alloys AA El-Daly, Y Swilem, AE Hammad Journal of Alloys and Compounds 471 (1-2), 98-104, 2009 | 131 | 2009 |
| Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions AA El-Daly, AE Hammad Materials & Design 40, 292-298, 2012 | 130 | 2012 |
| Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly AA El-Daly, AM El-Taher, S Gouda Journal of Alloys and Compounds 627, 268-275, 2015 | 126 | 2015 |
| Novel SiC nanoparticles-containing Sn–1.0 Ag–0.5 Cu solder with good drop impact performance AA El-Daly, A Fawzy, SF Mansour, MJ Younis Materials Science and Engineering: A 578, 62-71, 2013 | 100 | 2013 |
| Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0 Ag–0.5 Cu lead-free solder alloy AA El-Daly, GS Al-Ganainy, A Fawzy, MJ Younis Materials & Design 55, 837-845, 2014 | 99 | 2014 |
| Development of high strength Sn–0.7 Cu solders with the addition of small amount of Ag and In AA El-Daly, AE Hammad Journal of Alloys and Compounds 509 (34), 8554-8560, 2011 | 95 | 2011 |
| Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu AA El-Daly, A Fawzy, AZ Mohamad, AM El-Taher Journal of Alloys and Compounds 509 (13), 4574-4582, 2011 | 95 | 2011 |
| Novel Bi-containing Sn–1.5 Ag–0.7 Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products AA El-Daly, AM El-Taher, S Gouda Materials & Design (1980-2015) 65, 796-805, 2015 | 93 | 2015 |
| Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0 Ag–0.5 Cu solder alloy AA El-Daly, WM Desoky, TA Elmosalami, MG El-Shaarawy, AM Abdraboh Materials & Design (1980-2015) 65, 1196-1204, 2015 | 93 | 2015 |
| Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys AA El-Daly, AE Hammad Journal of Alloys and Compounds 505 (2), 793-800, 2010 | 79 | 2010 |
| Enhancing mechanical response of hypoeutectic Sn–6.5 Zn solder alloy using Ni and Sb additions AA El-Daly, AE Hammad, GA Al-Ganainy, AA Ibrahiem Materials & Design (1980-2015) 52, 966-973, 2013 | 77 | 2013 |
| Thermal analysis and mechanical properties of Sn–1.0 Ag–0.5 Cu solder alloy after modification with SiC nano-sized particles AA El-Daly, A Fawzy, SF Mansour, MJ Younis Journal of Materials Science: Materials in Electronics 24, 2976-2988, 2013 | 77 | 2013 |
| Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders AA El-Daly, AE Hammad, GS Al-Ganainy, M Ragab Materials Science and Engineering: A 608, 130-138, 2014 | 72 | 2014 |
| Improved creep resistance and thermal behavior of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solder AA El-Daly, AM El-Taher, TR Dalloul Journal of alloys and compounds 587, 32-39, 2014 | 72 | 2014 |
| Enhanced ductility and mechanical strength of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solders AA El-Daly, AM El-Taher, TR Dalloul Materials & Design 55, 309-318, 2014 | 68 | 2014 |
| Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders AA El-Daly, AE Hammad Materials Science and Engineering: A 527 (20), 5212-5219, 2010 | 66 | 2010 |
| Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5 Zn alloy AA El-Daly, AE Hammad, GS Al-Ganainy, AA Ibrahiem Materials & Design (1980-2015) 56, 594-603, 2014 | 65 | 2014 |
| Creep behavior of near-peritectic Sn–5Sb solders containing small amount of Ag and Cu AA El-Daly, AZ Mohamad, A Fawzy, AM El-Taher Materials Science and Engineering: A 528 (3), 1055-1062, 2011 | 65 | 2011 |
