A.A. El-Daly
A.A. El-Daly
Professor of Materials Science
Email confirmado em zu.edu.eg
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Microstructure, mechanical properties, and deformation behavior of Sn–1.0 Ag–0.5 Cu solder after Ni and Sb additions
AA El-Daly, AE Hammad, A Fawzy, DA Nasrallh
Materials & design 43, 40-49, 2013
1242013
Thermal and mechanical properties of Sn–Zn–Bi lead-free solder alloys
AA El-Daly, Y Swilem, MH Makled, MG El-Shaarawy, AM Abdraboh
Journal of Alloys and Compounds 484 (1-2), 134-142, 2009
1012009
Creep properties of Sn–Sb based lead-free solder alloys
AA El-Daly, Y Swilem, AE Hammad
Journal of Alloys and Compounds 471 (1-2), 98-104, 2009
982009
Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions
AA El-Daly, AE Hammad
Materials & Design 40, 292-298, 2012
952012
Development of high strength Sn–0.7 Cu solders with the addition of small amount of Ag and In
AA El-Daly, AE Hammad
Journal of Alloys and Compounds 509 (34), 8554-8560, 2011
802011
Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0 Ag–0.5 Cu solder alloy
AA El-Daly, WM Desoky, TA Elmosalami, MG El-Shaarawy, AM Abdraboh
Materials & Design (1980-2015) 65, 1196-1204, 2015
782015
Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly
AA El-Daly, AM El-Taher, S Gouda
Journal of Alloys and Compounds 627, 268-275, 2015
762015
Novel SiC nanoparticles-containing Sn–1.0 Ag–0.5 Cu solder with good drop impact performance
AA El-Daly, A Fawzy, SF Mansour, MJ Younis
Materials Science and Engineering: A 578, 62-71, 2013
762013
Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0 Ag–0.5 Cu lead-free solder alloy
AA El-Daly, GS Al-Ganainy, A Fawzy, MJ Younis
Materials & Design 55, 837-845, 2014
752014
Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu
AA El-Daly, A Fawzy, AZ Mohamad, AM El-Taher
Journal of Alloys and Compounds 509 (13), 4574-4582, 2011
702011
Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys
AA El-Daly, AE Hammad
Journal of Alloys and Compounds 505 (2), 793-800, 2010
702010
Improved creep resistance and thermal behavior of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solder
AA El-Daly, AM El-Taher, TR Dalloul
Journal of alloys and compounds 587, 32-39, 2014
642014
Novel Bi-containing Sn–1.5 Ag–0.7 Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products
AA El-Daly, AM El-Taher, S Gouda
Materials & Design (1980-2015) 65, 796-805, 2015
602015
Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders
AA El-Daly, AE Hammad, GS Al-Ganainy, M Ragab
Materials Science and Engineering: A 608, 130-138, 2014
592014
Enhancing mechanical response of hypoeutectic Sn–6.5 Zn solder alloy using Ni and Sb additions
AA El-Daly, AE Hammad, GA Al-Ganainy, AA Ibrahiem
Materials & Design (1980-2015) 52, 966-973, 2013
582013
Thermal analysis and mechanical properties of Sn–1.0 Ag–0.5 Cu solder alloy after modification with SiC nano-sized particles
AA El-Daly, A Fawzy, SF Mansour, MJ Younis
Journal of Materials Science: Materials in Electronics 24 (8), 2976-2988, 2013
582013
Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5 Zn alloy
AA El-Daly, AE Hammad, GS Al-Ganainy, AA Ibrahiem
Materials & Design (1980-2015) 56, 594-603, 2014
572014
Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders
AA El-Daly, AE Hammad
Materials Science and Engineering: A 527 (20), 5212-5219, 2010
552010
Enhanced ductility and mechanical strength of Ni-doped Sn–3.0 Ag–0.5 Cu lead-free solders
AA El-Daly, AM El-Taher, TR Dalloul
Materials & Design 55, 309-318, 2014
542014
Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0 Ag–0.5 Cu lead-free solders
AA El-Daly, AM El-Taher
Materials & Design 51, 789-796, 2013
522013
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