| Adaptive body bias aware implementation for ultra-low-voltage designs in 22FDX technology S Höppner, H Eisenreich, D Walter, A Scharfe, A Oefelein, F Schraut, ... IEEE Transactions on Circuits and Systems II: Express Briefs 67 (10), 2159-2163, 2019 | 29 | 2019 |
| How to Achieve World-Leading Energy Efficiency using 22FDX with Adaptive Body Biasing on an Arm Cortex-M4 IoT SoC S Höppner, H Eisenreich, D Walter, U Steeb, ASC Dmello, R Sinkwitz, ... ESSDERC 2019-49th European Solid-State Device Research Conference (ESSDERC …, 2019 | 25 | 2019 |
| A 16-Channel Fully Configurable Neural SoC With 1.52 W/Ch Signal Acquisition, 2.79 W/Ch Real-Time Spike Classifier, and 1.79 TOPS/W Deep Neural … SMA Zeinolabedin, FM Schüffny, R George, F Kelber, H Bauer, S Scholze, ... IEEE Transactions on Biomedical Circuits and Systems 16 (1), 94-107, 2022 | 21 | 2022 |
| Hardware Implementation of an OPC UA Server for Industrial Field Devices H Bauer, S Höppner, C Iatrou, Z Charania, S Hartmann, SU Rehman, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 29 (11 …, 2021 | 13 | 2021 |
| A 0.55 V 6.3 uW/MHz Arm Cortex-M4 MCU with Adaptive Reverse Body Bias and Single Rail SRAM D Walter, A Scharfe, A Oefelein, F Schraut, H Bauer, F Csaszar, ... 2020 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS), 1-3, 2020 | 12 | 2020 |
| OPC UA von der Cloud bis ins Feld: Durchgehende vertikale semantische Integration durch OPC UA in Hardware CP Iatrou, L Urbas, P Bauer, F Mendoza, H Deckert, T Merlin, ... atp magazin 62 (3), 90-101, 2020 | 1 | 2020 |
| Dynamic instruction set extension of microprocessors with embedded FPGAs H Bauer | 1 | 2017 |
| A RISC-V MCU with adaptive reverse body bias and ultra-low-power retention mode in 22 nm FD-SOI H Bauer, M Stolba, S Scholze, D Walter, C Mayr, A Oefelein, S Höppner, ... 2023 20th International SoC Design Conference (ISOCC), 67-68, 2023 | | 2023 |
| A 12-ADC 25-Core Smart MPSoC Using ABB in 22FDX for 77GHz MIMO Radars at 52.6 mW Average Power HA Gonzalez, B Vogginger, C Liu, M Stolba, F Kelber, H Bauer, ... 2023 IEEE Custom Integrated Circuits Conference (CICC), 1-2, 2023 | | 2023 |
| Opportunities For A Hardware-Based OPC UA Server Implementation In Industry 4.0 Z Charania, CP Iatrou, V Khaydarov, R Jacob, R Wittig, H Bauer, ... IECON 2021–47th Annual Conference of the IEEE Industrial Electronics Society …, 2021 | | 2021 |
| Exploration of FPGA architectures for tight coupled accelerators in a 22nm FDSOI technology H Bauer, S Höppner, J Partzsch, D Walter, C Mayr, F Schraut, ... 2017 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and …, 2017 | | 2017 |
Sebastian HöppnerTU DresdenVerified email at tu-dresden.de
