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Priyal H Shah
Priyal H Shah
AMD, Inc. (current), UC Berkeley (former), Virginia Tech (former), IIT Kharagpur (former)
Verified email at vt.edu
Title
Cited by
Cited by
Year
Optimal cure cycle parameters for minimizing residual stresses in fiber-reinforced polymer composite laminates
PH Shah, VA Halls, JQ Zheng, RC Batra
Journal of Composite Materials 52 (6), 773-792, 2017
582017
3D packaging for heterogeneous integration
R Agarwal, P Cheng, P Shah, B Wilkerson, R Swaminathan, J Wuu, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1103-1107, 2022
342022
Elastic moduli of covalently functionalized single layer graphene sheets
PH Shah, RC Batra
Computational materials science 95, 637-650, 2014
252014
Through-the-Thickness Stress Distributions near Edges of Composite Laminates using Stress Recovery Scheme and Third Order Shear and Normal Deformable Theory
PH Shah, RC Batra
Composite Structures 131, 397-413, 2015
172015
Active control of laminated composite truncated conical shells using vertically and obliquely reinforced 1-3 piezoelectric composites
PH Shah, MC Ray
European Journal of Mechanics-A/Solids 32, 1-12, 2012
172012
Bond pads for low temperature hybrid bonding
P Shah, MS Bhagavat
US Patent 10,937,755, 2021
162021
Stretching and bending deformations due to normal and shear tractions of doubly curved shells using third-order shear and normal deformable theory
PH Shah, RC Batra
Mechanics of Advanced Materials and Structures 25 (15-16), 1276-1296, 2018
162018
Stress singularities and transverse stresses near edges of doubly curved laminated shells using TSNDT and stress recovery scheme
PH Shah, RC Batra
European Journal of Mechanics-A/Solids 63, 68-83, 2016
162016
Effect of covalent functionalization on Young’s modulus of a single-wall carbon nanotube
PH Shah, RC Batra
Modeling of carbon nanotubes, graphene and their composites, 111-134, 2014
162014
In-plane elastic moduli of covalently functionalized single-wall carbon nanotubes
PH Shah, RC Batra
Computational Materials Science 83, 349–361, 2014
142014
Stacking sequence optimization for maximizing the first failure initiation load followed by progressive failure analysis until the ultimate load
U Taetragool, PH Shah, VA Halls, JQ Zheng, RC Batra
Composite Structures 180, 1007-1021, 2017
122017
Active structural-acoustic control of laminated composite truncated conical shells using smart damping treatment
PH Shah, MC Ray
Journal of Vibration and Acoustics 135 (2), 021001, 2013
102013
Fan-out package with multi-layer redistribution layer structure
R Agarwal, MS Bhagavat, P Shah
US Patent 10,593,620, 2020
82020
Effect of Reissner’s Parameter on Strain Energies of Spherical Sandwich Shells
PH Shah, RC Batra
AIAA journal 57 (11), 4942-4952, 2019
42019
Semiconductor chip with reduced pitch conductive pillars
P Shah, MS Bhagavat, L Fu
US Patent 10,943,880, 2021
32021
Molded semiconductor chip package with stair-step molding layer
P Shah, R Agarwal, MS Bhagavat, CH Cheng
US Patent App. 16/822,353, 2021
22021
Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package
P Shah, M Bhagavat
International Symposium on Microelectronics 2019 (1), 000110-000114, 2019
22019
Structural thermal interfacing for lidded semiconductor packages
P Shah, R Swaminathan, BP Wilkerson
US Patent App. 17/554,498, 2022
12022
Low temperature hybrid bonding
P Shah, R Agarwal, R Swaminathan, BP Wilkerson
US Patent 11,911,839, 2024
2024
Bond pads for low temperature hybrid bonding
P Shah, MS Bhagavat
US Patent 11,810,891, 2023
2023
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