| Solder joint reliability under realistic service conditions P Borgesen, S Hamasha, M Obaidat, V Raghavan, X Dai, M Meilunas, ... Microelectronics Reliability 53 (9-11), 1587-1591, 2013 | 58 | 2013 |
| Reliability and failure mechanism of solder joints in thermal cycling tests B Arfaei, S Mahin-Shirazi, S Joshi, M Anselm, P Borgesen, E Cotts, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 976-985, 2013 | 50 | 2013 |
| Accelerated vibration reliability testing of electronic assemblies using sine dwell with resonance tracking QT Su, MA Gharaibeh, AJ Stewart, JM Pitarresi, MK Anselm Journal of Electronic Packaging 140 (4), 041004, 2018 | 39 | 2018 |
| Effects of varying amplitudes on the fatigue life of lead free solder joints M Obaidat, S Hamasha, Y Jaradat, A Qasaimeh, B Arfaei, M Anselm, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1308-1314, 2013 | 35 | 2013 |
| LGAs vs. BGAs–lower profile and better reliability S Joshi, B Arfaei, A Singh, M Gharaibeh, M Obaidat, A Alazzam, ... Proc. SMTAI, 47-57, 2012 | 25 | 2012 |
| Board level drop test: Comparison of two ANSYS modeling approaches and correlation with testing M Gharaibeh, Q Su, J Pitarresi, M Anselm Research Gate, Universal Instruments Area Consortium, 2013 | 17 | 2013 |
| Effect of Sn grain morphology on failure mechanism and reliability of lead-free solder joints in thermal cycling tests B Arfaei, M Anselm, S Joshi, S Mahin-Shirazi, P Borgesen, E Cotts, ... SMTA Int, 539-550, 2013 | 17 | 2013 |
| Solder paste volume effects on assembly yield and reliability for bottom terminated components SS Sriperumbudur, M Meilunas, M Anselm Soldering & Surface Mount Technology 29 (2), 99-109, 2017 | 16 | 2017 |
| Controlling the superior reliability of lead free assemblies with short standoff height through design and materials selection B Arfaei, L Wentlent, S Joshi, M Anselm, P Borgesen ASME International Mechanical Engineering Congress and Exposition 45257, 467-473, 2012 | 15 | 2012 |
| On the fatigue life of microelectronic interconnects in cycling with varying amplitudes Y Jaradat, JE Owens, A Qasaimeh, B Arfaei, L Yin, M Anselm, P Borgesen Proc. SMTA Int, 2012 | 15 | 2012 |
| Modeling and characterization for vibration M Gharaibeh, Q Su, J Pitarresi, M Anselm Universal Instruments Advanced Research in Electronic Assemblies Consortium …, 2013 | 13* | 2013 |
| AREA-Effect of PCB surface finish on Sn grain morphology and thermal fatigue performance of lead-free solder joints B Arfaei, M Anselm, F Mutuku, E Cotts SMTA International, 406-414, 2014 | 11 | 2014 |
| A mechanistically justified model for life of SnAgCu solder joints in thermal cycling P Borgesen, L Yang, A Qasaimeh, L Yin, M Anselm Proc. SMTA Pan Pacific Conf, 1-6, 2013 | 10 | 2013 |
| QFN reliability, thermal shock, lead-free vs. SnPb, microstructure MK Anselm, R Ghaffarian 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 8 | 2017 |
| Epoxy fluxes: dip assembly process issues and reliability P Kondos, M Meilunas, M Anselm Surface Mount Technology International Conference, 2012 | 5 | 2012 |
| The effect of peak reflow temperature on thermal cycling performance and failure mode of hybrid low temperature solder joints R Coyle, M Anselm, F Hadian, S Kempaiah, A Raj, R Popowich, L Clark, ... Proceedings of SMTA International, 2021 | 4 | 2021 |
| Industry trends in photonics packaging: passive fiber and die coupling S Thomas, KY Bastardo, MK Anselm 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-8, 2017 | 3 | 2017 |
| A study on process, strength and microstructure analysis of low temperature SnBi-Containing solder pastes mixed with lead-free solder balls SCK Palaniappan Rochester Institute of Technology, 2016 | 3 | 2016 |
| Effect of Variation in the Reflow Profiles of Pb-free Solder on Life Times in Room Temperature Fatigue Tests F Mutuka, E Cotts, B Arfaei, M Anselm Surface Mount Technology Association International Proceedings, 2013 | 2 | 2013 |
| Investigation of Solder Joint Reliability Through Impact Fatigue Loading B Roggeman, M Anselm, P Guruprasad, J Pitarresi SMTAi, 2008 | 2 | 2008 |
