Optimal cure cycle parameters for minimizing residual stresses in fiber-reinforced polymer composite laminates PH Shah, VA Halls, JQ Zheng, RC Batra Journal of Composite Materials 52 (6), 773-792, 2017 | 60 | 2017 |
3D packaging for heterogeneous integration R Agarwal, P Cheng, P Shah, B Wilkerson, R Swaminathan, J Wuu, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1103-1107, 2022 | 38 | 2022 |
Elastic moduli of covalently functionalized single layer graphene sheets PH Shah, RC Batra Computational materials science 95, 637-650, 2014 | 25 | 2014 |
Bond pads for low temperature hybrid bonding P Shah, MS Bhagavat US Patent 10,937,755, 2021 | 18 | 2021 |
Active control of laminated composite truncated conical shells using vertically and obliquely reinforced 1-3 piezoelectric composites PH Shah, MC Ray European Journal of Mechanics-A/Solids 32, 1-12, 2012 | 18 | 2012 |
Stretching and bending deformations due to normal and shear tractions of doubly curved shells using third-order shear and normal deformable theory PH Shah, RC Batra Mechanics of Advanced Materials and Structures 25 (15-16), 1276-1296, 2018 | 17 | 2018 |
Through-the-Thickness Stress Distributions near Edges of Composite Laminates using Stress Recovery Scheme and Third Order Shear and Normal Deformable Theory PH Shah, RC Batra Composite Structures 131, 397-413, 2015 | 17 | 2015 |
Stress singularities and transverse stresses near edges of doubly curved laminated shells using TSNDT and stress recovery scheme PH Shah, RC Batra European Journal of Mechanics-A/Solids 63, 68-83, 2016 | 16 | 2016 |
Effect of covalent functionalization on Young’s modulus of a single-wall carbon nanotube PH Shah, RC Batra Modeling of carbon nanotubes, graphene and their composites, 111-134, 2014 | 16 | 2014 |
In-plane elastic moduli of covalently functionalized single-wall carbon nanotubes PH Shah, RC Batra Computational Materials Science 83, 349–361, 2014 | 14 | 2014 |
Stacking sequence optimization for maximizing the first failure initiation load followed by progressive failure analysis until the ultimate load U Taetragool, PH Shah, VA Halls, JQ Zheng, RC Batra Composite Structures 180, 1007-1021, 2017 | 13 | 2017 |
Active structural-acoustic control of laminated composite truncated conical shells using smart damping treatment PH Shah, MC Ray Journal of Vibration and Acoustics 135 (2), 021001, 2013 | 10 | 2013 |
Fan-out package with multi-layer redistribution layer structure R Agarwal, MS Bhagavat, P Shah US Patent 10,593,620, 2020 | 8 | 2020 |
Effect of Reissner’s Parameter on Strain Energies of Spherical Sandwich Shells PH Shah, RC Batra AIAA journal 57 (11), 4942-4952, 2019 | 5 | 2019 |
Semiconductor chip with reduced pitch conductive pillars P Shah, MS Bhagavat, L Fu US Patent 10,943,880, 2021 | 4 | 2021 |
Structural thermal interfacing for lidded semiconductor packages P Shah, R Swaminathan, BP Wilkerson US Patent App. 17/554,498, 2022 | 3 | 2022 |
Optimal Lid Design Parameters for Reducing Warpage of Flip-chip Package P Shah, M Bhagavat International Symposium on Microelectronics 2019 (1), 000110-000114, 2019 | 3 | 2019 |
Molded semiconductor chip package with stair-step molding layer P Shah, R Agarwal, MS Bhagavat, CH Cheng US Patent App. 16/822,353, 2021 | 2 | 2021 |
Low temperature hybrid bonding P Shah, R Agarwal, R Swaminathan, BP Wilkerson US Patent 11,911,839, 2024 | | 2024 |
Bond pads for low temperature hybrid bonding P Shah, MS Bhagavat US Patent 11,810,891, 2023 | | 2023 |